Spectral interferometry-based microwave-frequency vibrometry for integrated acoustic wave devices

Microwave phononics is a promising platform for sensing, computing, and quantum information science; thus, sensitive and high-throughput characterization tools are needed not only for device verification and optimization but also for revealing transient and nonlinear dynamics. Existing interferometric optical vibrometers for 2D mapping are challenged by operating point stabilization, surface reflectivity contrast, and long acquisition time. Here, we use spectral interferometry, which is insensitive to these factors and utilizes a continuous raster scanning scheme for vibration mapping with high throughput. We intensity-modulate our broadband light source with an electro-optic modulator to resolve vibrations at microwave frequencies. Our system requires no fast photodetector or digitizer operating in the microwave frequency range. We image the 1 GHz vibration field of a 300 × 150 µm² area of an entire surface acoustic wave device in 10 min with simultaneous surface profilometry. Our system has a vibration sensitivity of 120 fm/sqrt(Hz) and a linear throughput of 0.77 mm/s on the chip surface. The technique offers capabilities for characterizing a wide range of acoustic wave and micromechanical devices to better understand their behavior and performance.. Authors: Thomas, Joseph G. [Virginia Polytechnic Inst. and State Univ. (Virginia Tech), Blacksburg, VA (United States)] (ORCID:0000000236825931); Xi, Zichen [Virginia Polytechnic Inst. and State Univ. (Virginia Tech), Blacksburg, VA (United States)]; Ji, Jun [Virginia Polytechnic Inst. and State Univ. (Virginia Tech), Blacksburg, VA (United States)]; Shi, Guannan [Virginia Polytechnic Inst. and State Univ. (Virginia Tech), Blacksburg, VA (United States)]; Srijanto, Bernadeta R. [Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)] (ORCID:0000000211881267). DOE Contract: AC05-00OR22725. Subjects: 47 OTHER INSTRUMENTATION